Application FieldsDemand for highly accurate 3D measurements is increasing in various fields such as semiconductors, automobiles, mechanical engineering and medical care. Can be customized 3D system program and UI to meet customer's request, not commercial program which is difficult to handle in production line.
Semiconductor industryMeasuring thickness of wafer, measuring roughness and waviness, identifying semiconductor's structure and defect.
Glass industryMeasurement of wall thickness of container glass by non-contact method
Consumer goods industryMeasuring condition of combination of metal and glass of electronic products such as mobile phones and tablets.
Automobile industryMeasuring surface conditions and line profiles of automotive parts.
Machine engineering materialsMeasure mechanical engineering material surfaces, weld conditions, depth, etc.
3D System Application Case
Semiconductor's Roughness & Waviness Measurement
Mobile phone's parts - Groove's Depth/Width, Burr Measurement
Vehicle's parts - Line Profile Measurement and Analysis
3D System Features
Measurement of line scans with high speed
Irradiate the light uniformly
Replaceable Optical Probe
Profile / volume / surface measurement
Measurement of roughness / surface waves